The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Sep. 30, 2015
Applicant:

Linxens Holding, Mantes la Jolie, FR;

Inventors:

Eric Eymard, Pollgnac, FR;

Cyril Proye, Magnanville, FR;

Nicolas Guerineau, Pontoise, FR;

Christophe Paul, Courcelles sur Seine, FR;

Assignee:

Linxens Holding, Mantes la Jolie, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/067 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07749 (2013.01); G06K 19/0775 (2013.01); G06K 19/07747 (2013.01); G06K 19/07754 (2013.01); G06K 19/07769 (2013.01); G06K 19/067 (2013.01); G06K 19/077 (2013.01); G06K 19/07722 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/18165 (2013.01);
Abstract

A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.


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