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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10591116 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Feb. 17, 2017

Light emitting diode illumination device

Applicant:

Xiamen Eco Lighting Co. Ltd., Xiamen, CN;

Inventors:

Yanzeng Gao, Xiamen, CN;

Minghao Wu, Xiamen, CN;

Feng Wu, Xiamen, CN;

Assignee:

XIAMEN ECO LIGHTING CO. LTD., Xiamen, CN;

Attorneys:

Chun-Ming Shh

Lanway IPR Services

Primary Examiner:

Alexander K Garlen

Int. Cl.
CPC ...
F21K 9/237 (2016.01); F21V 23/00 (2015.01); F21K 9/90 (2016.01); F21V 29/70 (2015.01); F21K 9/238 (2016.01); F21K 9/232 (2016.01); F21V 3/06 (2018.01); F21V 23/06 (2006.01); F21Y 107/40 (2016.01); F21Y 107/70 (2016.01); F21Y 107/30 (2016.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01); F21Y 107/50 (2016.01);
U.S. Cl.
CPC ...
F21K 9/237 (2016.08); F21K 9/232 (2016.08); F21K 9/238 (2016.08); F21K 9/90 (2013.01); F21V 3/061 (2018.02); F21V 23/005 (2013.01); F21V 23/009 (2013.01); F21V 23/06 (2013.01); F21V 29/70 (2015.01); F21Y 2101/00 (2013.01); F21Y 2107/30 (2016.08); F21Y 2107/40 (2016.08); F21Y 2107/50 (2016.08); F21Y 2107/70 (2016.08); F21Y 2115/10 (2016.08);
Abstract

A light emitting diode illumination device comprises a light-transmitting encapsulant, a transparent core, a light source plate stereoscopic structure and a power supply device. The light-transmitting encapsulant and the transparent core can be made of glass material. The light source plate stereoscopic structure is constituted by a plurality of connecting sub-light source plates. The light source plate stereoscopic structure installed in the light-transmitting encapsulant is connected to the transparent core, and is supported by the transparent core. The sub-light source plate comprises a circuit board body and light-emitting diode dies. The light-emitting diode dies can be installed on one surface of the circuit board body by surface-mount technology. The power supply device is used for supplying power to the sub-light source plates, so that a plurality of sub-light source plates may provide illumination through the light-transmitting encapsulant.

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