The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Apr. 27, 2017
Applicant:

DE Nora Permelec Ltd, Fujisawa-shi, Kanagawa, JP;

Inventors:

Suguru Takahashi, Fujisawa, JP;

Akihiro Madono, Fujisawa, JP;

Takamichi Kishi, Fujisawa, JP;

Osamu Arimoto, Fujisawa, JP;

Assignee:

DE NORA PERMELEC LTD, Fujisawa-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25B 11/04 (2006.01); C25B 9/08 (2006.01); C25B 9/20 (2006.01); C25B 11/03 (2006.01); C25B 1/10 (2006.01); C25B 1/46 (2006.01); C25B 15/00 (2006.01);
U.S. Cl.
CPC ...
C25B 11/0405 (2013.01); C25B 1/10 (2013.01); C25B 1/46 (2013.01); C25B 9/08 (2013.01); C25B 9/20 (2013.01); C25B 11/03 (2013.01); C25B 11/04 (2013.01); C25B 15/00 (2013.01); Y02E 60/366 (2013.01);
Abstract

Provided are an electrode for electrolysis having excellent durability against reverse current, and a method that enables production of the electrode for electrolysis at low cost. The electrode for electrolysisincludes a conductive substrateon which a catalyst layer is formed, and a reverse current absorption bodythat is coupled to the conductive substratein a detachable manner, wherein the reverse current absorption bodyis formed from a sintered compact containing nickel. The method for producing the electrode for electrolysisincludes a sintered compact formation step of obtaining the sintered compact by sintering a raw material powder composed of any one of Raney nickel alloy particles containing nickel and an alkali-soluble metal element, metallic nickel particles, and a mixture of Raney nickel alloy particles and metallic nickel particles, and a coupling step of coupling the sintered compact to the conductive substrate


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