The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
May. 25, 2016
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Akira Uta, Annaka, JP;
Masayuki Ikeno, Annaka, JP;
Nobuaki Matsumoto, Annaka, JP;
Kohei Masuda, Annaka, JP;
Takafumi Sakamoto, Annaka, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). Ris independently a monovalent hydrocarbon group which does not independently include a Caliphatic unsaturated bond. Ris independently a hydrogen atom, —Si(CH), —Si(CH)(OH), —Si(CH)(CH═CH) or —Si(CH)(CH—CH═CH)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.