The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Dec. 27, 2012
Applicant:
Lg Hausys, Ltd., Seoul, KR;
Inventors:
Dong Kwan Kim, Ulsan, KR;
Min Hee Lee, Gunpo-si, KR;
Assignee:
LG HAUSYS, LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 220/18 (2006.01); C08F 20/10 (2006.01); C09D 133/04 (2006.01); C09D 4/00 (2006.01); C08F 220/06 (2006.01); B29D 7/01 (2006.01); C08F 2/48 (2006.01); B29D 7/00 (2006.01); C08F 220/10 (2006.01);
U.S. Cl.
CPC ...
C08F 220/18 (2013.01); B29D 7/00 (2013.01); B29D 7/01 (2013.01); C08F 2/48 (2013.01); C08F 20/10 (2013.01); C08F 220/06 (2013.01); C09D 4/00 (2013.01); C09D 133/04 (2013.01); C08F 220/10 (2013.01); C08L 2312/06 (2013.01);
Abstract
Provided are a curable compound, a photoinitiator, and a curable resin composition comprising at least two types of thermal initiators, each having different initiation reaction temperature. Since the curable resin composition can improve a curing rate while having a high conversion rate, the curable resin composition is suitable for manufacturing thick films.