The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Apr. 05, 2018
Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Zak C. Eckel, Thousand Oaks, CA (US);

Jacob M. Hundley, Thousand Oaks, CA (US);

Robert Mone, Malibu, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C04B 35/589 (2006.01); C04B 35/524 (2006.01); B28B 1/00 (2006.01); C04B 35/571 (2006.01); C04B 35/597 (2006.01); C04B 35/583 (2006.01); C08L 83/08 (2006.01); C04B 35/634 (2006.01); C08L 83/04 (2006.01); B33Y 70/00 (2020.01); C01B 21/064 (2006.01); C08L 83/02 (2006.01); C08G 77/20 (2006.01); C08G 77/28 (2006.01);
U.S. Cl.
CPC ...
C04B 35/589 (2013.01); B28B 1/001 (2013.01); C04B 35/524 (2013.01); C04B 35/571 (2013.01); C04B 35/583 (2013.01); C04B 35/597 (2013.01); C04B 35/63452 (2013.01); C08L 83/08 (2013.01); B33Y 70/00 (2014.12); C01B 21/0648 (2013.01); C01P 2004/03 (2013.01); C04B 2235/483 (2013.01); C04B 2235/486 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/77 (2013.01); C04B 2235/96 (2013.01); C08G 77/20 (2013.01); C08G 77/28 (2013.01); C08L 83/02 (2013.01); C08L 83/04 (2013.01);
Abstract

Resins for 3D printing of a preceramic composition loaded with a solid polymer filler, followed by converting the preceramic composition to a 3D-printed ceramic material, are described. Some variations provide a preceramic composition containing a radiation-curable liquid resin formulation and a solid polymer filler dispersed within the liquid resin formulation. The liquid resin formulation is compatible with stereolithography, UV curing, and/or 3D printing. The solid polymer filler may be an organic polymer, an inorganic polymer, or a combination thereof. The solid polymer filler may itself be an inorganic preceramic polymer, which may have the same composition as a polymerized variant of the liquid resin formulation, or a different composition. Many compositions are disclosed as options for the liquid resin formulation and the solid polymer filler.


Find Patent Forward Citations

Loading…