The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Nov. 06, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Andreas Wiesbauer, Poertschach, AT;
Christian Mandl, Salzburg, AT;
Marc Fueldner, Neubiberg, DE;
Shu-Ting Hsu, Unterhaching, DE;
Assignee:
INFINEON TECHNOLOGIES AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H04R 19/00 (2006.01); H04R 31/00 (2006.01); H04R 19/04 (2006.01); H04R 1/40 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 1/04 (2006.01); H04R 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0077 (2013.01); B81B 3/0021 (2013.01); B81C 1/00388 (2013.01); B81C 1/00523 (2013.01); H04R 1/04 (2013.01); H04R 1/406 (2013.01); H04R 3/005 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/16152 (2013.01); H04R 2201/003 (2013.01);
Abstract
An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.