The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Sep. 06, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Adam Joseph Fruehling, Garland, TX (US);
Juan Alejandro Herbsommer, Allen, TX (US);
Simon Joshua Jacobs, Lucas, TX (US);
Benjamin Stassen Cook, Addison, TX (US);
James F. Hallas, Allen, TX (US);
Randy Long, Richardson, TX (US);
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H03L 7/26 (2006.01); G01L 7/08 (2006.01); G04F 5/14 (2006.01); G01M 3/32 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0041 (2013.01); G01L 7/084 (2013.01); G01L 9/0016 (2013.01); G01L 9/0051 (2013.01); G01M 3/3272 (2013.01); G04F 5/14 (2013.01); H03L 7/26 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81B 2207/096 (2013.01); B81B 2207/097 (2013.01);
Abstract
An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.