The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Sep. 20, 2016
Conopco, Inc., Englewood Cliffs, NJ (US);
Adrian Michael Woodward, Bury St Edmonds, GB;
CONOPCO, INC., Englewood Cliffs, NJ (US);
Abstract
Provided is a process for thermoforming a gas and liquid permeable layer () of thermoplastic material having an average thickness of less than 1.0 mm, the process comprising the steps of bringing the layer of thermoplastic material, at a temperature below that required for thermoforming, into contact with a mould () at a temperature above that of a thermoforming temperature of the thermoplastic material; pressing the mould into contact with the layer of thermoplastic material, the contact between mould and thermoplastic material causing heat to transfer from the mould to the thermoplastic material and raising the temperature of the thermoplastic material to a thermoformable temperature; such pressing thereby causing thermoforming of the thermoplastic material to conform to the shape of the mould.