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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10589305 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Jan. 27, 2016

Substrate treating apparatus, and method of controlling the substrate treating apparatus

Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventor:

Yasuo Takahashi, Kyoto, JP;

Assignee:

SCREEN Holdings Co., Ltd., , JP;

Attorney:

Ostrolenk Faber LLP

Primary Examiner:

Kirsten Jolley

Int. Cl.
CPC ...
B05C 11/08 (2006.01); B05B 12/02 (2006.01); B05C 11/10 (2006.01); H01L 21/67 (2006.01); B05B 15/55 (2018.01); B05D 1/00 (2006.01); B05B 3/02 (2006.01); B05D 1/02 (2006.01); B05C 5/00 (2006.01);
U.S. Cl.
CPC ...
B05B 12/02 (2013.01); B05B 3/02 (2013.01); B05B 15/55 (2018.02); B05C 11/08 (2013.01); B05C 11/10 (2013.01); B05D 1/005 (2013.01); B05D 1/02 (2013.01); H01L 21/6715 (2013.01); H01L 21/67051 (2013.01); B05C 5/00 (2013.01);
Abstract

In a coating apparatus, a nozzle moving mechanism selectively grips any one of a plurality of coating solution nozzles, moves the gripped coating solution nozzle and a solvent nozzle together, and moves at least the solvent nozzle to a solvent suction unit. The moved solvent nozzle is caused to dispense a solvent to the solvent suction unit, and the gripped coating solution nozzle is caused to suck the solvent retained in the same solvent suction unit to which the solvent has been dispensed. Thus, since dispensation and suction of the solvent are done in the same solvent suction unit, the quantity of the solvent used can be held down. Further, a supply line for supplying the solvent does not need to be provided for the suction unit. The construction of the suction unit can therefore be made simple, and its cost can be held down.

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Takahashi, Yasuo. (2020). Substrate treating apparatus, and method of controlling the substrate treating apparatus (U.S. Patent No. 10589305). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10589305

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