The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Jan. 02, 2019
Applicant:
Microdermics Inc., Vancouver, CA;
Inventors:
Assignee:
Microdermics Inc., Vancouver, CA;
Primary Examiner:
Int. Cl.
CPC ...
A61M 37/00 (2006.01); B21G 1/00 (2006.01); B05D 1/36 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); B05D 1/36 (2013.01); B21G 1/00 (2013.01); B81C 1/00111 (2013.01); A61M 2037/003 (2013.01); A61M 2037/0023 (2013.01); A61M 2037/0053 (2013.01); B05D 2201/06 (2013.01);
Abstract
Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.