The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Jan. 26, 2016
Applicant:
Hewlett Packard Enterprise Development Lp, Houston, TX (US);
Inventors:
Kevin B. Leigh, Houston, TX (US);
George D. Megason, Spring, TX (US);
Assignee:
Hewlett Packard Enterprise Development LP, Houston, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 7/10 (2006.01); H05K 7/20 (2006.01); H01L 23/32 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H05K 7/1061 (2013.01); H01L 23/32 (2013.01); H01R 12/716 (2013.01); H05K 7/20 (2013.01);
Abstract
An example semiconductor assembly can include a hingeably-coupled component that receives a semiconductor board. In some examples, the component can be hingeably rotated to an open position to receive the semiconductor board. In some examples, the component can be hingeably detached from the assembly to receive the semiconductor board.