The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Jan. 23, 2017
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Arthur Lin, Taipei, TW;
Chienchih Chiu, Taipei, TW;
Ken Tsai, Taipei, TW;
Chiacheng Wei, Taipei, TW;
Assignee:
Hewlett-Packard Development Compnay, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); G06F 1/16 (2006.01); B32B 7/04 (2019.01); G05B 19/4093 (2006.01); H05K 5/00 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0217 (2013.01); B32B 7/04 (2013.01); G05B 19/40937 (2013.01); G06F 1/1613 (2013.01); G06F 1/1656 (2013.01); H05K 5/0004 (2013.01); H05K 5/04 (2013.01);
Abstract
In one example, a casing of an electronic device is disclosed which includes a metallic housing and a moldable material. The metallic housing may have a first surface and a second surface opposite to the first surface. The first surface may include an undercut physically contacting the second surface. The moldable material may be insert molded in the undercut of the metallic housing.