The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Apr. 07, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Takeshi Yuasa, Tokyo, JP;
Takeshi Oshima, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10734 (2013.01);
Abstract
Disclosed is an inter-board connection structure including a signal line conductor () provided in an outer layer of a printed circuit board (), a signal line conductor () extending in a direction from the signal line conductor () to a signal pad (), and forming a capacitive component between itself and a signal pad (), and a signal line conductor () branching and extending from a connecting portion between the signal line conductor () and the signal line conductor (), and electrically connected to the signal pad ().