The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

May. 23, 2019
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Kaoru Sudo, Kyoto, JP;

Ryuken Mizunuma, Kyoto, JP;

Masayuki Nakajima, Kyoto, JP;

Masanori Tsuji, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/42 (2006.01); H01Q 1/12 (2006.01); H01Q 21/28 (2006.01); H01Q 13/10 (2006.01); H01Q 1/32 (2006.01); H01Q 7/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/42 (2013.01); H01Q 1/12 (2013.01); H01Q 21/28 (2013.01); H01Q 1/243 (2013.01); H01Q 1/32 (2013.01); H01Q 1/3275 (2013.01); H01Q 7/00 (2013.01); H01Q 13/106 (2013.01);
Abstract

As such, in the disclosure, a slit is formed in a side plate. The slit has an opening in the upper end surface of the side plate. The opening has a width which is smaller than a thickness of the side plate and enables to correspond to a thickness t of the substrate and a length which enables to correspond to a length a of one side of the substrate. An RF antenna module is housed in the slit formed in the side plate of the housing to be accommodated in the housing by inserting the one side of the substrate through the opening of the slit, which is formed in the upper end surface of the side plate, and inserting the substrate into the slit by an amount equal to or larger than a length of another side of the substrate.


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