The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Dec. 19, 2017
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Woosup Lee, Gyeonggi-do, KR;

Yeonwoo Kim, Gyeonggi-do, KR;

Jungsik Park, Gyeonggi-do, KR;

Seunggil Jeon, Gyeonggi-do, KR;

Juseok Noh, Gyeonggi-do, KR;

Jaebong Chun, Gyeonggi-do, KR;

Hyunju Hong, Gyeonggi-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/40 (2006.01); H01Q 1/42 (2006.01); H01Q 9/26 (2006.01); H01Q 9/42 (2006.01); H01Q 21/28 (2006.01); H01Q 21/29 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/243 (2013.01); H01Q 1/40 (2013.01); H01Q 1/42 (2013.01); H01Q 9/26 (2013.01); H01Q 9/42 (2013.01); H01Q 21/28 (2013.01); H01Q 21/29 (2013.01);
Abstract

An electronic device having a housing formed of a conductive material, and an antenna device thereof. The electronic device includes a housing provided with a plurality of housing modules, and a printed circuit board positioned inside the housing, and having an antenna power feeding unit electrically connected to the printed circuited board. The plurality of housing modules may be at least partially formed of a conductive material. At least one of the conductive materials of the plurality of housing modules may be electrically connected to the antenna power feeding unit of the printed circuit board so as to function as an antenna of the electronic device. Various embodiments may be made based on the technical idea of the present disclosure.


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