The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Apr. 16, 2018
Applicant:
Tianma Japan, Ltd., Kawasaki, Kanagawa, JP;
Inventors:
Takumi Usukura, Kawasaki, JP;
Mamoru Okamoto, Kawasaki, JP;
Assignee:
TIANMA MICROELECTRONICS CO., LTD., Chenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/003 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 27/3244 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/566 (2013.01);
Abstract
Provided is a release film to be in contact with a surface of a base member and a surface of an object between the surface of the base member and the surface of the object. The release film includes a crystalline layer and a debond layer in contact with the crystalline layer. The debond layer has pores and includes an amorphous substance soluble in a solvent.