The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

May. 23, 2019
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Masahiko Kobayakawa, Kyoto, JP;

Hidekazu Toda, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01); H01L 33/54 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 33/60 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01);
Abstract

An LED moduleincludes LED chipsspaced apart from each other, and an LED chipoffset from a straight line connecting the LED chipsandand located between the LED chipsin the direction in which the LED chipsare spaced. The module further includes a leadwith a bonding portionand a mounting terminal surface, a leadwith a bonding portionand a mounting terminal surface, and a leadwith a bonding portionand a mounting terminal surface. The mounting terminal surfacesare flush with each other. Light from the LED chipsis emitted in the direction in which the mounting terminal surfacesandextend. Thus, light of different colors properly mixed can be emitted from a compact LED module.


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