The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Sep. 14, 2017
Applicant:

Alpha Power Solutions Limited, Hong Kong, CN;

Inventors:

Wing Chong Tony Chau, Hong Kong, CN;

Wing Kit Cheung, Hong Kong, CN;

Wai Tien Chan, Hong Kong, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/872 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/47 (2006.01); H01L 29/36 (2006.01); H01L 29/06 (2006.01); H01L 29/267 (2006.01);
U.S. Cl.
CPC ...
H01L 29/872 (2013.01); H01L 29/0619 (2013.01); H01L 29/1608 (2013.01); H01L 29/267 (2013.01); H01L 29/36 (2013.01); H01L 29/47 (2013.01); H01L 29/6606 (2013.01); H01L 29/66143 (2013.01); H01L 29/0692 (2013.01);
Abstract

A Schottky device includes a silicon carbide (SiC) substrate of a first conductivity type, a drift layer of the first conductivity type, a trench, a barrier layer of a second conductivity type, an electrically conductive material that at least partially fills the trench and contacts the barrier layer, a first electrode, and a second electrode. The drift layer is formed of SiC and is situated onto the SiC substrate. The trench extends from the top surface of the drift layer towards the SiC substrate. The barrier layer contacts the drifting layer and covers a sidewall and a bottom wall of the trench. The first electrode forms a Schottky junction with the drift layer and forms a low resistivity contact with the barrier layer and the electrically conductive material. The second electrode forms an ohmic contact with the SiC substrate.


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