The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Apr. 11, 2017
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Jürgen Moosburger, Lappersdorf, DE;
Lutz Höppel, Alteglofsheim, DE;
Norwin von Malm, Nittendorf, DE;
Assignee:
OSRAM OLED GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 29/861 (2006.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 29/861 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3157 (2013.01); H01L 24/03 (2013.01); H01L 24/11 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/94 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/036 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03334 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92143 (2013.01); H01L 2224/94 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first electrical contact and a second pin on the second electrical contact; and embedding the first pin, the second pin, and the protection diode in a molded body.