The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Oct. 27, 2017
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Takuma Shimoichi, Kyoto, JP;
Yasuhiro Kondo, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01); H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 27/016 (2013.01); H01L 28/10 (2013.01); H01L 28/20 (2013.01); H01L 28/60 (2013.01); H05K 1/029 (2013.01); H05K 1/0289 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 1/167 (2013.01); H05K 3/107 (2013.01); H01L 2223/6672 (2013.01); H01L 2924/0002 (2013.01); H05K 3/146 (2013.01); H05K 2201/0317 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09981 (2013.01); H05K 2201/10181 (2013.01); H05K 2203/0353 (2013.01); H05K 2203/1338 (2013.01);
Abstract
A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.