The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Oct. 11, 2017
Applicant:
Fairchild Korea Semiconductor Ltd., Bucheon, KR;
Inventors:
Assignee:
Semiconductor Components Industries, LLC (BHB), Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/62 (2006.01); H01L 23/495 (2006.01); H01L 23/38 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 23/38 (2013.01); H01L 23/4093 (2013.01); H01L 2225/06513 (2013.01);
Abstract
In a general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate. The apparatus can include a conductive clip coupled to the semiconductor die. The leadframe can be disposed between the semiconductor die and the substrate, and the semiconductor die can be disposed between the conductive clip and the leadframe.