The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Mar. 31, 2015
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:
Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); A61B 8/12 (2006.01); A61B 8/00 (2006.01); H01L 23/28 (2006.01); H01L 23/00 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01); B06B 1/02 (2006.01); H01L 21/78 (2006.01); H02N 1/00 (2006.01); H05K 1/18 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4821 (2013.01); A61B 8/12 (2013.01); A61B 8/445 (2013.01); A61B 8/4494 (2013.01); B06B 1/0292 (2013.01); H01L 21/78 (2013.01); H01L 23/041 (2013.01); H01L 23/28 (2013.01); H01L 23/481 (2013.01); H01L 23/4822 (2013.01); H01L 24/01 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H02N 1/006 (2013.01); H05K 1/181 (2013.01); H01L 41/0475 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01); H05K 2201/10151 (2013.01);
Abstract

An integrated circuit (IC) die () is disclosed having a major surface delimited by at least one edge () of the IC die, said major surface carrying a plurality of electrically conductive contact plates () extending from said major surface beyond the at least one edge such that each contact plate includes an exposed contact surface portion () delimited by the at least one edge for mating with an electrically conductive further contact surface portion () on at least one further edge () of a body (), said at least one further edge delimiting a cavity for receiving the IC die. An ultrasound probe including such an IC die and a method of providing such an IC die with contacts are also disclosed.


Find Patent Forward Citations

Jacobs, Egbertus. (2020). Ic die, ultrasound probe, ultrasonic diagnostic system and method (U.S. Patent No. 10586753). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10586753

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…