The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Feb. 20, 2017
Applicant:
Nippon Electric Glass Co., Ltd., Otsu-shi, Shiga, JP;
Inventors:
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/10 (2006.01); H01L 23/08 (2006.01); H01L 33/48 (2010.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/10 (2013.01); H01L 21/4803 (2013.01); H01L 21/50 (2013.01); H01L 23/02 (2013.01); H01L 23/08 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 2924/16195 (2013.01); H01L 2933/0033 (2013.01);
Abstract
Provided are an airtight package that can increase the bonding strength between the sealing material layer and the container and a method for manufacturing the same. An airtight packageincludes: a containerwith a frame; a glass liddisposed on top of the frameand sealing the container; and a sealing material layerdisposed between the frameand the glass lidand bonding the glass lidand the containertogether, wherein in the sealing material layera bonding surfacebetween the sealing material layerand the containeris larger than a bonding surfacebetween the sealing material layerand the glass lid