The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Jan. 23, 2018
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Wei-E Wang, Austin, TX (US);

Mark S. Rodder, Dallas, TX (US);

Borna J. Obradovic, Leander, TX (US);

Joon Goo Hong, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 27/092 (2006.01); H01L 29/08 (2006.01); H01L 29/167 (2006.01); H01L 21/225 (2006.01); H01L 21/268 (2006.01); H01L 21/324 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823814 (2013.01); H01L 21/02057 (2013.01); H01L 21/2257 (2013.01); H01L 21/2686 (2013.01); H01L 21/324 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 29/0847 (2013.01); H01L 29/167 (2013.01); H01L 29/7839 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method for providing a semiconductor device and the device so formed are described. A doped semiconductor layer is deposited on a semiconductor underlayer. At least a portion of the semiconductor underlayer is exposed. A dopant for the doped semiconductor layer is selected from a p-type dopant and an n-type dopant. An ultraviolet-assisted low temperature (UVLT) anneal of the doped semiconductor layer is performed in an ambient. The ambient is selected from an oxidizing ambient and a nitriding ambient. The oxidizing ambient is used for the n-type dopant. The nitriding ambient is used for the p-type dopant. A sacrificial layer is formed by the doped semiconductor layer during the UVLT anneal. The dopant is driven into the portion of the semiconductor underlayer from the doped semiconductor layer by the UVLT anneal, thereby forming a doped semiconductor underlayer. The sacrificial layer is then removed.


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