The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Oct. 27, 2017
Applicant:

Semes Co., Ltd., Cheonan-si, Chungcheongnam-do, KR;

Inventors:

Jae-Youl Kim, Gunpo-si, KR;

Jong Seok Seo, Cheonan-si, KR;

Seongsu Kim, Pyeongtaek-si, KR;

Assignee:

SEMES CO., LTD, Cheonan-si, Chungcheongnam-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); G03F 1/68 (2012.01); H01L 21/027 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); G03F 1/68 (2013.01); H01L 21/0273 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02318 (2013.01); H01L 21/6719 (2013.01); H01L 21/67109 (2013.01); H01L 21/67178 (2013.01); H01L 21/67248 (2013.01); H01L 21/68714 (2013.01);
Abstract

Embodiments of the inventive concept relate to an apparatus for supporting a substrate and a method for treating a substrate. The substrate support apparatus includes a substrate support member including a support plate having an upper surface that supports a substrate, and a heating member provided in the support plate to heat the substrate, wherein an area of the support plate has a buffer area, in which a buffer space for restricting a heat transfer rate of heat provided from the heating member to the upper surface is formed. The buffer space insulates a central area and a peripheral area, thereby maximizing a temperature difference between the central area and the peripheral area.


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