The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Dec. 21, 2015
Applicant:

Wuxi Huaying Microelectronics Technology Co., Ltd, Wuxi, Jiangsu, CN;

Inventors:

Sophia Wen, Jiangsu, CN;

Zhikai Wang, Jiangsu, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/02 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67023 (2013.01); H01L 21/02 (2013.01); H01L 21/67 (2013.01); H01L 21/6715 (2013.01); H01L 21/67109 (2013.01); H01L 21/67161 (2013.01); H01L 21/67386 (2013.01); H01L 21/67393 (2013.01); H01L 21/67778 (2013.01); H01L 21/6838 (2013.01); H01L 21/68785 (2013.01);
Abstract

A semiconductor processing apparatus is provided. The apparatus includes a first chamber portion and a second chamber portion movable relative to the first chamber portion between an open position and a closed position. The first chamber portion includes a recessed area formed on an internal surface of the first chamber portion. The first chamber portion also includes one or more through-holes connected to respective locations of the recessed area. When the second chamber portion is in the closed position and a semiconductor wafer is housed in the micro chamber, the recessed area is sealed by a surface of the semiconductor wafer to form a closed channel. The surface may be processed by a processing fluid flowing in the closed channel. Accordingly, a flowing direction and a flowing speed of the processing fluid may be accurately controlled, and an amount of the processing fluid consumed may be greatly reduced.


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