The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Aug. 08, 2016
Applicant:
North Carolina State University, Raleigh, NC (US);
Inventor:
Jagdish Narayan, Raleigh, NC (US);
Assignee:
NORTH CAROLINA STATE UNIVERSITY, Raleigh, NC (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B 21/064 (2006.01); H01F 1/42 (2006.01); H01L 21/02 (2006.01); C30B 29/04 (2006.01); C23C 14/06 (2006.01); G01R 33/12 (2006.01); H03B 15/00 (2006.01); G01R 33/032 (2006.01); C01B 32/05 (2017.01); C01B 32/188 (2017.01); C01B 32/25 (2017.01); C30B 1/02 (2006.01); C30B 23/02 (2006.01); C30B 23/06 (2006.01); C30B 29/40 (2006.01); C30B 19/08 (2006.01); C30B 29/62 (2006.01); C30B 31/06 (2006.01); C30B 31/22 (2006.01); H01L 21/268 (2006.01); C23C 14/28 (2006.01); C30B 13/10 (2006.01); C30B 13/24 (2006.01); H01L 43/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0259 (2013.01); C01B 21/064 (2013.01); C01B 21/0648 (2013.01); C01B 32/05 (2017.08); C01B 32/188 (2017.08); C01B 32/25 (2017.08); C23C 14/0605 (2013.01); C23C 14/0647 (2013.01); C23C 14/28 (2013.01); C30B 1/023 (2013.01); C30B 13/10 (2013.01); C30B 13/24 (2013.01); C30B 19/08 (2013.01); C30B 23/025 (2013.01); C30B 23/066 (2013.01); C30B 29/04 (2013.01); C30B 29/403 (2013.01); C30B 29/62 (2013.01); C30B 31/06 (2013.01); C30B 31/22 (2013.01); G01R 33/032 (2013.01); G01R 33/1284 (2013.01); H01F 1/42 (2013.01); H01L 21/0254 (2013.01); H01L 21/02527 (2013.01); H01L 21/02595 (2013.01); H01L 21/02603 (2013.01); H01L 21/02609 (2013.01); H01L 21/02631 (2013.01); H01L 21/02686 (2013.01); H01L 21/268 (2013.01); H03B 15/006 (2013.01); C01P 2002/02 (2013.01); C01P 2004/03 (2013.01); C01P 2006/40 (2013.01); C01P 2006/42 (2013.01); C01P 2006/90 (2013.01); H01L 43/10 (2013.01);
Abstract
Using processes disclosed herein, materials and structures are created and used. For example, processes can include melting boron nitride or amorphous carbon into an undercooled state followed by quenching. Exemplary new materials disclosed herein can be ferromagnetic and/or harder than diamond. Materials disclosed herein may include dopants in concentrations exceeding thermodynamic solubility limits. A novel phase of solid carbon has structure different than diamond and graphite.