The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

May. 10, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Rohit Mishra, Santa Clara, CA (US);

Yongjia Li, Sunnyvale, CA (US);

Mir Abdulla Al Galib, Santa Clara, CA (US);

Minoru Takahashi, Chiba, JP;

Masato Ito, Chiba, JP;

Jinhan Choi, San Ramon, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 27/11551 (2017.01); H01L 27/11578 (2017.01); H01L 27/1157 (2017.01); H01L 27/11524 (2017.01);
U.S. Cl.
CPC ...
H01L 21/02063 (2013.01); H01L 21/02057 (2013.01); H01L 21/02661 (2013.01); H01L 27/11551 (2013.01); H01L 27/11578 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01);
Abstract

In an embodiment, a method of processing a substrate includes introducing a first process gas or a mixture of the first process gas and a second process gas into an etch chamber; exposing the substrate to the first process gas or to the mixture of the first and second process gases, the substrate having halogen residue formed on an exposed surface, the substrate having high aspect ratio features; forming and maintaining a plasma of the first process gas or a plasma of the mixture of the first and second process gases in the etch chamber to remove the residue from the surface by applying a first source power; exposing the substrate to the second process gas; and forming and maintaining a plasma of the second process gas in the etch chamber to remove the residue from the surface by applying a second source power and a bias power.


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