The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Sep. 19, 2017
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventor:

Yasushi Takeda, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01F 2017/008 (2013.01); H01F 2017/0066 (2013.01); H01F 2027/2809 (2013.01);
Abstract

An electronic component includes an element assembly that includes a magnetic layer and a non-magnetic layer and a coil that is provided within the element assembly and that is wound in a spiral form. The coil includes a plurality of laminated layers of coil wires. The non-magnetic layer includes an inter-wire non-magnetic layer located between at least one pair of the coil wires that are adjacent in a lamination direction and a radial direction non-magnetic layer located on at least one of an outer side portion and an inner side portion in a radial direction of the coil. The radial direction non-magnetic layer is spaced apart from the inter-wire non-magnetic layer.


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