The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Nov. 27, 2017
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Chongqing Boe Optoelectronics Technology Co., Ltd., Chongqing, CN;

Inventors:

Zhicai Xu, Beijing, CN;

Kui Zhang, Beijing, CN;

Hui Li, Beijing, CN;

Mengqiu Liu, Beijing, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1362 (2006.01); G02B 5/20 (2006.01); G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
G02F 1/1362 (2013.01); G02B 5/201 (2013.01); G02F 1/13452 (2013.01); G02F 1/13458 (2013.01); G02F 1/136286 (2013.01); G02F 2001/136222 (2013.01);
Abstract

The present disclosure relates to a COA substrate and a manufacturing method thereof, a display device. The COA substrate includes the following layers in a wiring region: a first conduction layer including a signal wire lead; an insulation layer having a first via to expose the signal wire lead; a second conduction layer including a first metal pattern with a second via; a flat layer having a hollowed-out region; and a connection pattern. The second via is at least in part located within the hollowed-out region, and orthographic projections of a border of a portion of the second via which is located within the hollowed-out region and a border of the first via on the base substrate overlap. The connection pattern extends through the first via and the second via and connects to the signal wire lead.


Find Patent Forward Citations

Loading…