The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Mar. 10, 2017
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Min Ji Kim, Seoul, KR;

Do Yub Kim, Seoul, KR;

Min Hak Kim, Seoul, KR;

Yeong Seok Yu, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 19/00 (2006.01); F21V 29/505 (2015.01); F21V 29/507 (2015.01); F21V 29/70 (2015.01); F21V 29/15 (2015.01);
U.S. Cl.
CPC ...
F21V 29/70 (2015.01); F21V 19/001 (2013.01); F21V 29/505 (2015.01); F21V 29/507 (2015.01); F21V 29/15 (2015.01);
Abstract

An embodiment comprises: a board; a light-emitting module including at least one light-emitting element arranged in a first region of the board and a driving element, arranged in a second region of the board, for driving the at least one light-emitting element; a heat-dissipating member disposed below the lower surface of the board; and a heat-dissipating pad disposed between the board and the heat-dissipating member, wherein the heat-dissipating pad comprises: a heat-dissipating plate disposed on the upper surface of the heat-dissipating member; and a protruding part protruding from the upper surface of the heat-dissipating plate and supporting the lower surface of the first region of the board, and the lower surface of the board is spaced apart from the heat-dissipating plate.


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