The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Sep. 02, 2016
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Masakatsu Hotta, Annaka, JP;

Kazuhiro Oishi, Annaka, JP;

Yoshiaki Koike, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08K 3/04 (2006.01); C08K 5/14 (2006.01); C08K 7/06 (2006.01); C08K 9/06 (2006.01); H01B 3/28 (2006.01);
U.S. Cl.
CPC ...
C08K 3/36 (2013.01); C08K 3/041 (2017.05); C08K 5/14 (2013.01); C08K 7/06 (2013.01); C08K 9/06 (2013.01); H01B 3/28 (2013.01); C08K 2201/006 (2013.01);
Abstract

Disclosed herein are a silicone rubber composition and a power cable. The silicone rubber composition has excellent insulation properties and a high permittivity and which can further become a silicone dielectric material having a low specific gravity and a high strength. The power cable in which a terminal connection part or an intermediate connection part is composed of a cured molded product of the just-mentioned composition. The silicone rubber composition includes (A) 100 parts by weight of an organopolysiloxane containing at least two Si-bonded alkenyl groups in one molecule thereof, (B) 5 to 50 parts by weight of a reinforcing silica having a specific surface area measured by a BET method of 50 m/g to 400 m/g, (C) 0.3 to 3 parts by weight of carbon nanotubes having an average diameter of 0.5 nm to 50 nm, and (D) a curing agent in an amount necessary for curing of the composition. A cured molded product of the composition has a volume resistivity of at least 10Ω·cm and a relative permittivity of at least 5.


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