The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Nov. 10, 2016
Applicant:

Aeroprobe Corporation, Christiansburg, VA (US);

Inventors:

Kumar Kandasamy, Blacksburg, VA (US);

Jeffrey Patrick Schultz, Blacksburg, VA (US);

Assignee:

MELD Manufacturing Corporation, Christiansburg, VA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/12 (2006.01); B32B 15/01 (2006.01); B23K 20/233 (2006.01); B23K 20/227 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B32B 3/30 (2006.01); B32B 7/04 (2019.01); B23K 103/02 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/14 (2006.01); B23K 103/08 (2006.01); B23K 103/18 (2006.01); B23K 103/20 (2006.01); B23K 103/22 (2006.01); B23K 103/24 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B32B 15/01 (2013.01); B23K 20/1205 (2013.01); B23K 20/127 (2013.01); B23K 20/128 (2013.01); B23K 20/129 (2013.01); B23K 20/1215 (2013.01); B23K 20/1245 (2013.01); B23K 20/1265 (2013.01); B23K 20/1295 (2013.01); B23K 20/227 (2013.01); B23K 20/2275 (2013.01); B23K 20/2333 (2013.01); B32B 3/30 (2013.01); B32B 7/04 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B23K 2103/02 (2018.08); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/14 (2018.08); B23K 2103/15 (2018.08); B23K 2103/166 (2018.08); B23K 2103/18 (2018.08); B23K 2103/20 (2018.08); B23K 2103/22 (2018.08); B23K 2103/24 (2018.08); B23K 2103/26 (2018.08); B32B 2250/02 (2013.01); B32B 2307/54 (2013.01); B32B 2605/08 (2013.01); B32B 2605/12 (2013.01); B32B 2605/18 (2013.01);
Abstract

A method for joining materials using additive friction stir techniques is provided. The method joins a material to a substrate, especially where the material to be joined and the substrate are dissimilar metals. One such method comprises (a) providing a substrate with one or more grooves; (b) rotating and translating an additive friction-stir tool relative to the substrate; (c) feeding a filler material through the additive friction-stir tool; and (d) depositing the filler material into the one or more grooves of the substrate. Translation and rotation of the tool causes heating and plastic deformation of the filler material, which flows into the grooves of the substrate resulting in an interlocking bond between the substrate and filler material. In embodiments, the depositing of the filler material causes deformation of the grooves in the substrate and an interlocking configuration between the grooves of the substrate and the filler material results.


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