The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Jul. 11, 2016
Applicant:

DE LA Rue International Limited, Basingstoke, Hampshire, GB;

Inventor:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); B44C 1/17 (2006.01); B41M 3/14 (2006.01); B42D 25/324 (2014.01); B01D 24/48 (2006.01); B01D 35/12 (2006.01); B01D 24/12 (2006.01); B01D 24/46 (2006.01); B42D 25/23 (2014.01); B42D 25/24 (2014.01); B42D 25/29 (2014.01);
U.S. Cl.
CPC ...
B29D 11/00288 (2013.01); B41M 3/144 (2013.01); B44C 1/1729 (2013.01); B01D 24/12 (2013.01); B01D 24/4631 (2013.01); B01D 24/4869 (2013.01); B01D 35/12 (2013.01); B42D 25/23 (2014.10); B42D 25/24 (2014.10); B42D 25/29 (2014.10); B42D 25/324 (2014.10);
Abstract

A method of applying a pattern formed of two different materials to a pattern support layer includes: providing a die form having a surface with recesses defining the pattern; applying a first curable material to a surface first region, received in some of the first region recesses and partially filling a first region recess set; applying a second curable material to some of the surface first region, the second curable material at least partially fills the first set of the first region recesses; contacting a pattern support layer with the die form surface to cover the recesses containing both the first and second curable materials; separating the pattern support layer from the die form surface, the first and second curable materials in the covered recesses removed therefrom and retained on the pattern support layer; and curing the first and second curable materials during and/or after the second and third steps.


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