The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Dec. 10, 2018
Toyota Jidosha Kabushiki Kaisha, Toyota-Shi, Aichi-Ken, JP;
Hidetoshi Yomoda, Okazaki, JP;
Ryo Yokozawa, Toyota, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
Abstract
A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.