The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Nov. 07, 2014
Applicant:

Eos Gmbh Electro Optical Systems, Krailling, DE;

Inventors:

Martin Heugel, Landsberg am Lech, DE;

Georg Fey, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/286 (2017.01); B29C 64/232 (2017.01); B22F 3/105 (2006.01); B22F 3/24 (2006.01); B29C 64/40 (2017.01); B29C 64/165 (2017.01); B29C 64/20 (2017.01); B29C 64/35 (2017.01); B29C 64/153 (2017.01); B29C 64/386 (2017.01); B33Y 30/00 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
B22F 3/1055 (2013.01); B22F 3/24 (2013.01); B29C 64/153 (2017.08); B29C 64/165 (2017.08); B29C 64/20 (2017.08); B29C 64/35 (2017.08); B29C 64/386 (2017.08); B29C 64/40 (2017.08); B22F 2003/1056 (2013.01); B22F 2003/1057 (2013.01); B22F 2003/1059 (2013.01); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); Y02P 10/295 (2015.11);
Abstract

A modular system () for producing a three-dimensional object () by layerwise application and selective solidification of a pulverulent build material () contains a first module (-) suitable for carrying out a first process used for the production of the three-dimensional object (), and at least a second and a third module (-) suitable for carrying out a further process used for the production of the three-dimensional object (). The first to third modules (-) are configured so that the second or the third module, or both, can selectively and replaceably be connected to the first module in such a way that their housings are coupled to one another directly.


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