The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jul. 20, 2017
Applicant:
Apple Inc., Cupertino, CA (US);
Inventor:
Shravan Bharadwaj, San Jose, CA (US);
Assignee:
APPLE INC., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/10 (2006.01); H05K 3/32 (2006.01); G06F 1/16 (2006.01); H04M 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 5/0247 (2013.01); G06F 1/1633 (2013.01); G06F 1/1656 (2013.01); H04M 1/18 (2013.01); H04M 1/185 (2013.01); H05K 1/0284 (2013.01); H05K 1/0366 (2013.01); H05K 1/092 (2013.01); H05K 3/10 (2013.01); H05K 3/32 (2013.01); H05K 3/0014 (2013.01); H05K 3/4611 (2013.01); H05K 2201/0999 (2013.01);
Abstract
A housing made from a circuit laminate includes first and second layers coupled together. Each includes a rigid, electrically insulating non-planar structural layer, flexible conductive traces disposed on surfaces of the structural layer, and flexible connector layers contacting to the flexible conductive traces. The housing may be formed from the circuit laminate using thermoforming or another process that co-molds the first and second layers. The structural layers stiffen the housing and/or form an environmental or other barrier so that the housing protects an internal component.