The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

May. 11, 2017
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Arinobu Nakamura, Mie, JP;

Tou Chin, Mie, JP;

Assignees:

AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01L 23/36 (2013.01); H01L 23/4006 (2013.01); H05K 1/181 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01); H05K 7/209 (2013.01); H05K 7/2049 (2013.01); H05K 7/20472 (2013.01); H05K 2201/066 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10409 (2013.01);
Abstract

Provided is a circuit assembly including: a circuit board; a bus bar having a top face fixed to a bottom face of the circuit board; an electronic component disposed on a top face of the bus bar; a heat dissipation member disposed on a bottom face of the bus bar; a heat transfer member interposed between the bus bar and the heat dissipation member, to transfer heat of the bus bar to the heat dissipation member; and a screw extending through a stack of the circuit board and the bus bar, the screw screwed to the heat dissipation member, fixing the stack to the heat dissipation member; and a spacer interposed between the circuit board and the heat dissipation member, the spacer surrounding at least a portion of an outer circumference of a shaft portion of the screw, and maintaining a thickness of the heat transfer member substantially uniform.


Find Patent Forward Citations

Loading…