The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Dec. 28, 2018
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Yang Bai, Shenzhen, CN;

Rui Zhang, Shenzhen, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 19/04 (2006.01); H04R 19/00 (2006.01); H04R 1/04 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/0072 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); H04R 2201/003 (2013.01);
Abstract

The present disclosure provides an MEMS microphone, including a substrate having a back cavity and a capacitor system fixedly disposed on the substrate, where the capacitor system includes a backplane and a vibrating diaphragm that are spaced apart from each other, the backplane includes a backplane insulation layer and a backplane conducting layer disposed on the backplane insulation layer, an outer edge of the backplane conducting layer is provided with a notch, the backplane insulation layer is provided with a first through hole, the first through hole includes a first sound hole disposed in a location corresponding to the notch, and the notch is in communication with the first sound hole. The present disclosure reduces stress concentration of the backplane and reducing a risk of structural failure such as breaking of the backplane.


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