The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Sep. 23, 2016
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Chun-Neng Liao, New Taipei, TW;
Meng-Hsin Chiang, Zhubei, TW;
Chun-Wei Chang, Taipei, TW;
Chee-Kong Ung, Hsinchu, TW;
Ching-Chih Li, New Taipei, TW;
Assignee:
MediaTek Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 5/1252 (2006.01); H03H 7/06 (2006.01); H01L 25/16 (2006.01); H01L 23/64 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03K 5/1252 (2013.01); H01L 23/642 (2013.01); H01L 23/647 (2013.01); H01L 25/16 (2013.01); H01L 25/165 (2013.01); H03H 3/02 (2013.01); H03H 7/06 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.