The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Dec. 21, 2017
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yuichi Ito, Kyoto, JP;

Taro Hirai, Kyoto, JP;

Katsuhiko Fujikawa, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 1/24 (2006.01); H01Q 23/00 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/526 (2013.01); H01Q 1/241 (2013.01); H01Q 9/0407 (2013.01); H01Q 23/00 (2013.01);
Abstract

An antenna-integrated wireless module is provided which does not need a metal case, and which can realize size reduction. A shield layer is formed on an upper surface of a resin sealing layer, which is disposed on one principal surface of a substrate and which covers a wireless region and an antenna region, such that the shield layer does not cover a portion of the resin sealing layer, the portion being positioned directly above the antenna region. Hence the shield layer formed on the upper surface of the resin sealing layer on the side covering the wireless region can serve to suppress electromagnetic waves radiated from a wireless functional section, which is disposed in a region overlapping the wireless region when looking at the module in a plan view, and which includes an RF circuit disposed at least on the one principal surface of the substrate or inside the substrate.


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