The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jul. 22, 2016
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Koshi Nishida, Osaka, JP;

Kozo Yano, Osaka, JP;

Katsuhiko Kishimoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); C23C 14/12 (2006.01); C23C 14/24 (2006.01); C23C 14/04 (2006.01); H01L 27/32 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0011 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01); C23C 14/24 (2013.01); H01L 27/3246 (2013.01); H01L 51/001 (2013.01); H01L 51/56 (2013.01); H01L 2227/323 (2013.01);
Abstract

A deposition mask and a manufacturing method thereof capable of performing vapor deposition at a desired place, without causing any gap between the deposition mask and a substrate for vapor deposition having a surface of irregularity, even when depositing a vapor deposition material only at a predetermined place on a bottom part of the substrate for vapor deposition, are provided. The manufacturing method includes preparing a dummy substrate having irregularity corresponding to a surface shape of the substrate for vapor deposition (step S), coating a liquid resin material on an uneven surface of the dummy substrate to form a resin coating layer (step S), and raising the temperature of the resin coating layer and baking the resin coating layer to obtain a baked resin film (step S). The manufacturing method further includes forming a desired opening pattern on the baked resin film attached to the dummy substrate to obtain a resin film having the desired opening pattern (step S), and subsequently peeling off the resin film from the dummy substrate to obtain a deposition mask (step S).


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