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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10580942 B1

PDFFull Text
Date of Patent:
Mar. 03, 2020

Filed:

Jan. 22, 2018

Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component

Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Luca Haiberger, Regensburg, DE;

Matthias Sperl, Mintraching, DE;

Assignee:

OSRAM OPTO SEMICONDUCTORS GMBH, Regensburg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Zandra V Smith

Assistant Examiner:

Andre C Stevenson

Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/00 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 24/96 (2013.01); H01L 33/0095 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/19 (2013.01); H01L 2224/24 (2013.01); H01L 2224/82 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/0033 (2013.01);
Abstract

An electronic component, an optoelectronic component, and a component arrangement are disclosed. In an embodiment the electronic component includes an electronic semiconductor chip and a molded body, wherein the molded body covers at least one side face of the electronic semiconductor chip, wherein a surface of the electronic semiconductor chip is at least partly not covered by the molded body, wherein the molded body includes a first side face with a peg, and wherein the molded body includes a second side face with a groove matching the peg.

Find Patent Forward Citations

Haiberger, Luca. (2020). Electronic component, optoelectronic component, component arrangement, and method for producing an electronic component (U.S. Patent No. 10580942). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10580942

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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