The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Aug. 30, 2016
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Alejandro Aldrin A. Narag, II, Singapore, SG;
Ravi Palaniswamy, Singapore, SG;
Assignee:
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 33/62 (2013.01); H05K 1/189 (2013.01); H05K 2201/10106 (2013.01);
Abstract
A flexible dielectric substrate () defines a LESD mounting region () including two conductive filled vias () extending through the flexible dielectric substrate () and the LESD mounting region is substantially surrounded by two conductive frame portions (). The frame portions are in electrical connection with the conductive filled vias (), respectively. The conductive filled vias () form conductive features in the mounting region () that are co-planar with each other.