The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jul. 07, 2017
Nanyang Technological University, Singapore, SG;
Joseph Chang, Singapore, SG;
Tong Ge, Singapore, SG;
Tong Lin, Singapore, SG;
Jia Zhou, Singapore, SG;
Nanyang Technological University, Singapore, SG;
Abstract
A method of fabricating an electrical circuit assembly on a flexible substrate comprises: identifying one or more bending-sensitive elements of an electrical circuit assembly, each bending-sensitive element having a performance that varies when said bending-sensitive element is flexed; splitting said one or more bending-sensitive elements into a first portion and a second portion, wherein the first portion and the second portion are functionally equivalent and together equate to said bending-sensitive element; printing the first portion of said bending-sensitive element on a first surface of the flexible substrate; printing the second portion of said bending-sensitive element on a second surface of the flexible substrate, diametrically opposite the first portion such that bending of the flexible substrate has an opposite effect on each of the first and second portions thereby serving to substantially cancel the effect on each portion out; and electrically connecting the first portion and the second portion.