The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Oct. 25, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Christian Djelassi-Tscheck, Villach, AT;

Bernhard Auer, Millstatt, AT;

Markus Ladurner, A-Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 25/16 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/40175 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49112 (2013.01); H01L 2224/49113 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01);
Abstract

Examples disclosed herein involve integrated circuit chip arrangements. An example integrated circuit (IC) package may include a first semiconductor chip that includes a first metal-oxide-semiconductor field-effect transistor (MOSFET) and a second semiconductor chip mounted within a housing of the IC package. The second semiconductor chip may include a second MOSFET and a control circuit configured with a first driver for the first MOSFET and a second driver for the second MOSFET. The first semiconductor chip may be mounted to the second semiconductor chip opposite a base of the IC package.


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