The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jun. 26, 2017
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Sumalee Likitvanichkul Fagan, Painted Post, NY (US);

Weiguo Miao, Horseheads, NY (US);

Eric James Nichols, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); B29C 65/00 (2006.01); B29C 70/72 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); B29C 66/73 (2013.01); B29C 70/72 (2013.01); H01L 21/6833 (2013.01); H01L 21/6835 (2013.01); H01L 21/6875 (2013.01); H01L 21/68757 (2013.01); H01L 23/367 (2013.01); H01L 23/498 (2013.01);
Abstract

A carrier substrate includes a base layer having a first surface, and having a second surface that is parallel to and opposite of the first surface. The carrier substrate further includes a glass layer bonded to the first surface of the base layer. The carrier substrate has a Young's modulus greater than or equal to 150 GPa. A carrier substrate includes a polycrystalline ceramic and has a Young's modulus greater than or equal to 150 GPa. The carrier substrate has a coefficient of thermal expansion of greater than or equal to 20×10/° C. to less than or equal to 120×10/° C. over a range from 25° C. to 500° C.


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