The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Apr. 16, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jin Woo Kim, Suwon-si, KR;

Chang Hak Choi, Suwon-si, KR;

Kang Heon Hur, Suwon-si, KR;

Seok Hyun Yoon, Suwon-si, KR;

Seung Ho Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/08 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); C04B 35/628 (2006.01); C04B 35/462 (2006.01); C04B 35/468 (2006.01); C04B 35/48 (2006.01); C04B 35/465 (2006.01); C04B 35/47 (2006.01); C01G 23/00 (2006.01); H01G 4/248 (2006.01);
U.S. Cl.
CPC ...
H01G 4/1281 (2013.01); C01G 23/006 (2013.01); C04B 35/462 (2013.01); C04B 35/465 (2013.01); C04B 35/4682 (2013.01); C04B 35/47 (2013.01); C04B 35/48 (2013.01); C04B 35/6281 (2013.01); C04B 35/62802 (2013.01); C04B 35/62818 (2013.01); C04B 35/62821 (2013.01); C04B 35/62823 (2013.01); C04B 35/62894 (2013.01); H01B 1/08 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01); H01G 4/30 (2013.01); C01P 2002/54 (2013.01); C01P 2004/64 (2013.01); C01P 2004/84 (2013.01); C04B 2235/3201 (2013.01); C04B 2235/3203 (2013.01); C04B 2235/3206 (2013.01); C04B 2235/3208 (2013.01); C04B 2235/3213 (2013.01); C04B 2235/3215 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3224 (2013.01); C04B 2235/3225 (2013.01); C04B 2235/3227 (2013.01); C04B 2235/3236 (2013.01); C04B 2235/3239 (2013.01); C04B 2235/3244 (2013.01); C04B 2235/3249 (2013.01); C04B 2235/3251 (2013.01); C04B 2235/3262 (2013.01); C04B 2235/3409 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/781 (2013.01); C04B 2235/785 (2013.01); C04B 2235/85 (2013.01); H01G 4/1263 (2013.01); H01G 4/248 (2013.01);
Abstract

A multilayer ceramic electronic component includes: a body part including dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and external electrodes disposed on an outer surface of the body part and electrically connected to the internal electrodes. The dielectric layer includes grains including: a semiconductive or conductive grain core region containing a base material represented by ABO, where A is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf, and a doping material including a rare earth element; and an insulating grain shell region enclosing the grain core region.


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