The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jan. 15, 2018
Applicant:

Cambrios Film Solutions Corporation, Virgin Islands, GB;

Inventors:

Jonathan S. Alden, Mountain View, CA (US);

Haixia Dai, Mountain View, CA (US);

Michael R. Knapp, Emerald Hills, CA (US);

Shuo Na, Sao Jose, CA (US);

Hash Pakbaz, Hayward, CA (US);

Florian Pschenitzka, San Francisco, CA (US);

Xina Quan, Saratoga, CA (US);

Michael A. Spaid, Mountain View, CA (US);

Adrian Winoto, San Francisco, CA (US);

Jeffrey Wolk, Half Moon Bay, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C03C 17/00 (2006.01); B82Y 20/00 (2011.01); B82Y 30/00 (2011.01); C09D 11/52 (2014.01); C23F 11/02 (2006.01); C30B 7/02 (2006.01); C30B 29/02 (2006.01); C30B 29/60 (2006.01); C30B 33/00 (2006.01); G02F 1/1343 (2006.01); H01L 31/0224 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/04 (2006.01); H01L 27/146 (2006.01); H01L 31/0216 (2014.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B82Y 20/00 (2013.01); B82Y 30/00 (2013.01); C03C 17/007 (2013.01); C03C 17/008 (2013.01); C09D 11/52 (2013.01); C23F 11/02 (2013.01); C30B 7/02 (2013.01); C30B 29/02 (2013.01); C30B 29/60 (2013.01); C30B 33/00 (2013.01); G02F 1/13439 (2013.01); H01L 31/022466 (2013.01); B22F 1/0025 (2013.01); B22F 2998/00 (2013.01); C03C 2217/445 (2013.01); C03C 2217/479 (2013.01); H01L 27/14623 (2013.01); H01L 31/02164 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/49175 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0269 (2013.01); H05K 1/097 (2013.01); H05K 3/048 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/026 (2013.01); H05K 2201/10128 (2013.01); H05K 2203/1545 (2013.01); Y10S 977/762 (2013.01);
Abstract

A method of fabricating a transparent conductor includes the following steps. The first step is drawing a substrate from a first reel to a second reel along a travelling path, and along the travelling path. Next step is forming a metal nanowire dispersion layer on the substrate and then drying the metal nanowire dispersion layer to form a metal nanowire network layer. Next step is forming a matrix layer on the metal nanowire network layer so as to form a conductive layer of the metal nanowire network layer embedded in the matrix layer.


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